MediaTek has come to Las Vegas to confirm that its flagship Wi-Fi 7 platform has attracted a number of client OEMs and partners already. The 6nm Filogic 880 chip is officially the one conferring upgrades to 320MHz channels, 4096-QAM modulation and Multi-Link Operation (MLO) aggregation on many other devices from a range of companies at CES 2023.
Lenovo, for example, has confirmed that it will handle the connectivity necessary for the “immersive, high-performance PC gaming experiences“to be delivered with the next generation of the Legion line-up, as has Asus for its own upcoming gaming line-up.
Furthermore, AMD has now indicated its intent to “combine“Wi-Fi 7 modules from MediaTek with Ryzen platforms. Companies such as TP-Link and Buffalo have also announced that they have taken the Filogic 880 up for inclusion in their own latest products.
Therefore, MediaTek’s Wi-Fi 7 platforms will have a place in the laptops, routers and streaming devices of the future, as it asserted during the 880’s launch. They will also have a role in industry, however, having been chosen by the wireless testing group LitePoint, as well as electronics and semiconductor validation specialists NI.
Finally, Korea Telecom now backs MediaTek Wi-Fi 7 technology to deliver the “throughput“necessary to satisfy next-gen consumer demand for connectivity-driven entertainment and communication.
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I became a professional writer and editor shortly after graduation. My degrees are in biomedical sciences; however, they led to some experience in the biotech area, which convinced me of its potential to revolutionize our health, environment and lives in general. This developed into an all-consuming interest in more aspects of tech over time: I can never write enough on the latest electronics, gadgets and innovations. My other interests include imaging, astronomy, and streaming all the things. Oh, and coffee.
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